Solutions of surface-preparation
Bonding, an innovative assembly solution, without screws or rivets! From mechanical applications to high-tech applications in the field of smart cards, SUPRATEC Syneo and its partners offer easy-to-use products with associated equipment for treatment before bonding, adhesive application and exposure. The advantages of bonding: universality of the process (all substrates), corrosion resistance of the bonding, noise, shock and vibration damping, watertightness of connections, lightening of structures, esthetics.
Today, the challenges of bonding go beyond the choice of an adhesive or a dispensing equipment. The implementation and integration of a bonding process on a production line are essential to enable you to achieve optimum productivity.
With its know-how, SUPRATEC Syneo has been developing complete solutions integrated on the production lines of the largest industrial sites for 20 years.Our Bonding experience