UV light-sensitive adhesives
DELO-KATIOBOND® is an epoxy resin based adhesive which is particularly suitable for the assembly and protection of electronic components. It has proven itself in large-scale production and is also used for bonding opaque parts, in particular thanks to the pre-activation principle.
Technical data sheetDue to its good chemical resistance and pre-activation properties, DELO-KATIOBOND® 4578 is used for the bonding of opaque plastic/plastic parts and for bonding applications in the electronic sector and connected objects. DELO-KATIOBOND® KB554 is used for the corrosion protection and the vibration and shock resistance of high electronic components.
The DELO-KATIOBOND® adhesive is used for chip encapsulation applications (Dam & Fill). A bead of viscous KATIOBOND® DF698 (Dam) adhesive is applied around the circumference of the chip, before encapsulating it with the low-viscosity KATIOBOND® 4670 (Fill) adhesive.
Dedicated to LED, reflector and lens bonding applications, DELO-KATIOBOND® OB642 is suitable for optical applications. The DELO-KATIOBOND® OB642 adhesive has properties such as non-yellowing to light, good resistance to high temperature, no outgassing and is suitable for reflow processes.
DELO-KATIOBOND® is used for bonding opaque metal-to-metal parts, especially due to the pre-activation principle. DELO-KATIOBOND® 4578 has a good chemical resistance and is suitable for bonding applications in the luxury and cosmetic sector for the bonding of perfume caps.
Due to its good chemical resistance and pre-activation properties, DELO-KATIOBOND® is used in the bonding of opaque plastic/metal parts and for bonding applications in general industry. In this application, DELO-KATIOBOND® is used to bond the plastic spirit level in its housing to the metal part.
DELO-KATIOBOND® is a one-component epoxy resin that is activated by UV and/or visible light. The exposure time is between 20 and 60 seconds maximum to obtain a complete polymerisation.
The interest of this adhesive lies in the patented principle of pre-activation: photocurable after 2 to 8 seconds of exposure, it is possible to assemble the elements or add a second component during the 10 to 30 seconds following exposure. The adhesive then cures to final strength at room temperature for 24 hours without further irradiation. An ideal function for mechanically mounted parts where the adhesive is not immediately stressed.
The UV light sensitive epoxy adhesive cures in seconds, for very short production cycle times and in series, especially for potting or transparent materials. Fast and efficient bonding, especially of opaque components, is achieved by the patented pre-activation process.
>>HOW TO PROTECT YOUR ELECTRONIC COMPONENTS?The wide range of elasticity (from hard to flexible) of the DELO-KATIOBOND® epoxy adhesive references allows it to adapt to the most specific materials. The UV resin has an extremely high stability against UV radiation, high ambient temperatures (-40°C to +150°C) and possible chemical aggressions.
The Dam&Fill® bonding/coating process protects the chips. The dam deposits a high viscosity encapsulation bead around the chip. The low viscosity fill compound (Fill) is applied inside the dam to coat the chip.
This encapsulation method protects the chip by ensuring high mechanical strength and moisture resistance.
The light sensitive epoxy adhesive can also be used for casting, potting or coating, leaving a completely dry surface after curing.
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